Performance Comparison Of Traditional Cooling Solution Vs. Copper Spade Radiator

Revolutionize Thermal Management: Introducing Our High-Performance Copper Skiving Fin Heat Sinks

Maximize heat dissipation in compact spaces with our latest innovation in precision cooling. Engineered from a single block of pure copper, our Skiving Fin heat sinks deliver up to 30% higher thermal efficiency compared to traditional methods, ensuring unparalleled reliability for your most demanding electronic applications.

 

Performance comparison of traditional cooling solution vs. copper spade radiator

Thermal performance

Traditional heat dissipation solution: There is contact thermal resistance and there is a bottleneck in heat dissipation efficiency.

Copper shovel-tooth radiator: The fins and the substrate are integrally formed, with zero contact thermal resistance and extremely high heat conduction efficiency.

 

Structural density and area

Traditional heat dissipation solution: The fins are thicker, the spacing is wider, and the effective heat dissipation area is limited.

Copper shovel-tooth radiator: Ultra-thin (about 0.2mm) and dense fins can be made to significantly increase the heat dissipation surface area.

 

Craftsmanship and Reliability

Traditional heat dissipation solutions: mostly use inserts or extrusion, and the interface may be loose.

Copper shovel tooth radiator: integrated shovel tooth molding, solid structure, no risk of loosening and falling off, and longer life.

 

Design flexibility

Traditional heat dissipation solution: Customized molds are costly and require a long cycle.

Copper shovel-tooth radiator: No need for expensive non-standard molds, supports high degree of customization (size, color, shape), fast response.

 

Core technology: Why choose the copper shovel tooth technology?

The shovel tooth technology uses high-precision tools to "shovel" continuous, ultra-thin fins from the copper substrate. This process solves the fundamental bottleneck of traditional heat dissipation design:

Eliminate thermal resistance: The fins and the base are made of the same material, completely eliminating the contact thermal resistance between the joint surfaces, and there is no obstacle to heat transfer.

Achieving a high gear ratio: The copper material allows for an extremely high fin height to spacing ratio, thereby creating a huge effective heat dissipation area within a limited volume, which is something that the extrusion process cannot achieve.

Guarantee long-term reliability: The one-piece structure has no physical interfaces, eliminating the risk of fins loosening due to vibration or hot and cold cycles. It is especially suitable for industrial and communication equipment with high reliability requirements.

 

Product specifications and customization capabilities

We offer standard sizes and have strong customization services to meet your precise needs.

Material: High-purity copper, ensuring optimal thermal conductivity (thermal conductivity up to 400 W/m·K).

 

Typical specification range:

Fin thickness: 0.1mm - 1.0mm

Fin height: up to 50mm

Base size: can be customized according to customer drawings

Surface treatment: Anti-oxidation coating, nickel plating and other surface treatment options are available.

Accessories: Optional plastic push pins facilitate safe and secure mounting to the PCB and protect circuit board integrity.

 

Target application scenario

Our copper spade-tooth heat sinks are ideal for the following high-performance, high-density electronic devices:

High-end computing: server CPU/GPU, data center switches, artificial intelligence accelerator cards.

Optical communications and 5G: high-speed optical modules, radio frequency power amplifiers, and base station core chips.

Industrial and automotive electronics: IGBT power modules, vehicle chargers, automatic driving control units.

Renewable energy: photovoltaic inverters, energy storage system power management chips.