Embedding Liquid Cooling Plate with Water Copper Pipe Heatsink

Product introduction

The liquid cooling plate is mainly composed of a metal substrate (usually aluminum alloy) and a high thermal conductivity copper pipe buried in it. The metal substrate has good heat conductivity and can quickly spread the heat, while the copper pipe acts as a channel for the coolant and is responsible for bringing the absorbed heat out of the liquid cooling plate. Through the optimized structural design, the entire product realizes the efficient transfer of heat from the heating source to the coolant, thus effectively reducing the working temperature of the equipment, ensuring its stable operation in the appropriate temperature environment, and avoiding performance degradation, failure and even damage caused by overheating.

Product working principle

Heat conduction: When the heating element is in close contact with the metal substrate surface of the liquid cooling plate, heat is rapidly transferred from the heating source to the metal substrate based on the principle of heat conduction. Because the metal substrate uses a material with high thermal conductivity (such as the thermal conductivity of aluminum alloy is generally about 100-200 W/(m·K)), the heat can be quickly diffused in the substrate, so that the temperature of the area in contact with the copper pipe increases, thus forming a temperature difference between the copper pipe and the substrate.

Liquid cooling cycle: The coolant (usually water or glycol solution) is driven by an external circulation system and flows into a copper pipe embedded in a metal substrate. Due to the temperature difference between the copper pipe and the surrounding heated metal substrate, heat is transferred from the metal substrate to the coolant through the pipe wall, so that the coolant temperature rises and becomes a hot coolant. Under the action of the circulation system, the hot coolant flows out of the copper pipe and enters the external radiator for heat dissipation.

Heat dissipation: In an external radiator, the hot coolant dissipates heat by heat exchange with the air. The radiator usually uses a large area of cooling fins and fans to force convection to increase the contact area and heat exchange efficiency between the coolant and the air, so that the coolant temperature is reduced and the coolant is changed back to a low-temperature coolant. The cryogenic coolant is then transported back to the copper pipe of the liquid cooling plate by the circulating pump to begin the next round of cooling cycle, so that the heat generated by the electronic components is continuously taken away and the low temperature operation of the equipment is maintained.

Product features and advantages

Efficient heat dissipation performance: The copper pipe has a high thermal conductivity (copper thermal conductivity is about 380-400 W/(m·K)), which can quickly transfer heat to the coolant, and the large area heat dissipation design of the metal substrate further enhances the heat diffusion ability. Compared with the traditional air-cooled radiator, under the same heat dissipation conditions, the embedded copper tube radiator liquid cooling plate can reduce the temperature of the heating element by 15-30 ° C or more, significantly improving the heat dissipation efficiency, effectively meeting the heat dissipation requirements of high-power electronic equipment, and ensuring the stable operation and performance of the equipment. For example, in the CPU and GPU heat dissipation applications of high-performance servers, it can ensure that the temperature is always within the safe range during high load operation, and avoid crash and calculation errors caused by overheating.

Precise temperature control: Through the precise design of the copper pipe diameter, wall thickness, spacing and coolant flow rate, flow rate and other parameters, you can achieve accurate temperature control of the heating element. This is critical for applications that are highly sensitive to temperature, such as precision electronic instruments, optical devices, and biomedical devices. It can control the temperature fluctuation within a very small range, ensure that the equipment works in a stable temperature environment, improve the accuracy and repeatability of the measurement or experiment, ensure the stable performance of the equipment and reliable data, and provide a solid heat dissipation guarantee for the research and production in the high-tech field.

Compact design: The design of the buried copper pipe makes the overall structure of the liquid cooling plate more compact, occupies less space, and is easy to be integrated into a variety of complex electronic equipment. Whether it is a laptop with limited space, a small server, or an industrial control system with high requirements for compact layout, it can be easily adapted, providing strong support for the miniaturization and integrated development of equipment. At the same time, the compact structure is also conducive to reducing the thermal resistance inside the device, improving the heat dissipation efficiency, and will not cause too much interference to the layout and functional realization of other components inside the device, helping to improve the overall performance and portability of the device.

High reliability and stability: The products are made of high-quality materials, and the copper pipes and metal substrates have good corrosion resistance, mechanical strength and tightness. Coolant circulation system pumps, pipes and joints and other components are also strictly screened and tested, can be long-term stable operation in harsh working environment, such as high temperature, high humidity, strong vibration and other environmental conditions, still maintain excellent heat dissipation performance, reduce the risk of equipment shutdown due to cooling system failure, improve equipment availability and maintenance. Reduce operating costs and maintenance workload. In addition, the structural design of the liquid cooling plate has been optimized to effectively resist thermal and mechanical stress, avoid deformation, cracking and other problems due to long-term use, and further ensure the reliability and stability of the product.

Low noise operation: Compared with the traditional air-cooled radiator, the liquid cooling plate of the embedded copper radiator generates very low noise during operation. Because it mainly relies on the natural convection of the coolant and the low-speed fan of the external radiator (even without the fan in some efficient cooling designs) for heat dissipation, the large noise generated by high-speed fan rotation in the air-cooled radiator is avoided, providing a quiet operating environment for noise-sensitive application scenarios (such as libraries, offices, medical environments, etc.). Improve the user experience and work efficiency, but also in line with the development trend of modern electronic devices for low noise design.

Strong scalability: The layout, size and parameters of the coolant circulation system can be flexibly adjusted according to different heat dissipation requirements, easily meeting the heat dissipation requirements of small power to high power electronic devices. By increasing the number of copper pipes, optimizing the arrangement, and improving the flow rate and heat dissipation capacity of the coolant, it can achieve effective heat dissipation of higher power heating components, and provide a broad space for heat dissipation solutions for the performance upgrade and technological innovation of electronic equipment. It has strong adaptability and scalability, and can keep up with the pace of the development of electronic technology. Meet changing market needs.

FAQ

Q: What is the embedded copper tube radiator liquid cooling plate?

A: The embedded copper tube radiator liquid cooling plate is a heat dissipation device that is embedded in the copper tube and circulates the heat through the liquid working medium (such as water, coolant, etc.) in the copper tube. It is often used for efficient thermal management, such as high-performance computers, servers and new energy vehicles.

Q: What is the working principle of the liquid cooling plate of the embedded copper tube radiator?

A: The liquid cooling plate of the embedded copper tube radiator is powered by a water pump, so that the coolant circulates in the closed copper tube. The heat generated by the heating device is transferred to the liquid cooling plate, and then carried away by the coolant, and finally the heat is released to the external environment through the condenser.

Q: Why was copper chosen as the material for embedding copper pipes?

A: Copper has good thermal conductivity and high mechanical strength, and can transfer heat quickly and effectively. In addition, copper has corrosion resistance and is easy to process, making it an ideal material for embedding copper pipes.

Q: What are the advantages of the embedded copper tube radiator liquid cooling plate?

A: The embedded copper tube radiator liquid cooling plate has the advantages of high heat dissipation efficiency, good temperature uniformity, low noise and high reliability. It is suitable for thermal management applications with high power density and space constraints.

Q: What are the production processes of the liquid cooling plate of the embedded copper tube radiator?

A: The production process includes raw material stamping, cleaning, soldering, riveting, brazing, testing and sealing steps. Among them, brazing is the key connection process to ensure the tightness and reliability of the flow path.

Q: How to ensure the sealing of the liquid cooling plate of the embedded copper tube radiator?

A: Tightness is one of the key requirements for liquid cooling plates. The production process requires strict control of welding quality and material selection, and air tightness testing to ensure no leaks.

Q: In what scenarios is the liquid cooling plate embedded with a copper tube radiator applicable?

A: It is suitable for the heat dissipation of high-power electronic equipment, such as CPU, GPU, memory bar, server, base station, new energy vehicle power battery pack, aerospace equipment, industrial manufacturing equipment and medical equipment.

Q: How to determine whether the liquid cooling plate of the embedded copper tube radiator is working normally?

A: It can be determined by monitoring the operating temperature of the equipment and the flow rate of the coolant. If the temperature is stable and below the set threshold, and the flow rate is normal, the heat sink is working properly.