Liquid Cooling Copper Thermal Cold Plate Heat Sink

Product introduction

Liquid cooled copper hot and cold plate radiator is an efficient cooling device based on the principle of liquid cooling, which is mainly composed of copper hot and cold plate, cooling pipe, coolant circulation system and shell. The core component of the hot and cold plate is made of copper with high thermal conductivity, and the internal design has a precise flow channel structure for the flow of coolant. When the heating element in the electronic device is in close contact with the hot and cold plate, the heat is rapidly transmitted to the hot and cold plate, and the coolant flows through the flow channel inside the hot and cold plate under the drive of the circulation system, the heat is absorbed and taken out, and the heat is finally dissipated to the surrounding environment through the external radiator, so as to realize the efficient cooling of the heating element and ensure the stable operation of the equipment within the appropriate temperature range.

Product working principle

Heat conduction: The heat generated by the electronic components is transferred by heat conduction to the surface of the copper hot and cold plate designed with it. Because copper has a very high thermal conductivity (usually around 380-400 W/(m·K)), it can quickly and evenly spread heat to the entire hot and cold plate, making a large temperature difference between the hot and cold plate and the coolant, creating favorable conditions for subsequent heat exchange.

Liquid cooling cycle: The coolant is driven by the circulating pump and flows into the internal flow path from the inlet of the hot and cold plate. The design of the runner is carefully optimized to ensure that the coolant can fully contact the various areas of the hot and cold plate to maximize heat absorption. As the coolant flows in the flow channel, heat is transferred from the hot and cold plate to the coolant, making the coolant temperature rise and become a hot coolant. The hot coolant flows from the outlet of the hot and cold plate into the external radiator.

Heat dissipation: In an external radiator, the hot coolant dissipates heat by heat exchange with the air. The radiator usually uses a large area of cooling fins and fans to force convection, increase the contact area and heat exchange efficiency between the coolant and the air, reduce the temperature of the coolant, return to the low temperature coolant, and then transfer the hot cold plate through the circulation pump to start the next round of cooling cycle, so reciprocating, continuously taking away the heat generated by the electronic components. Maintain low temperature operation of equipment.

Product features and advantages

Excellent heat dissipation performance: The high thermal conductivity of the copper material combined with the optimized flow path design enables the liquid cooled copper hot and cold plate radiator to transfer and dissipate heat efficiently. In the heat dissipation applications of high-power electronic devices such as server CPU and GPU, compared with traditional air-cooled heat sinks, the chip temperature can be reduced by 20-30 ° C or more, significantly improving the stability and reliability of the device, effectively avoiding performance degradation and crash caused by overheating, and extending the service life of the device. It provides a solid heat dissipation guarantee for high performance computing, artificial intelligence training and other application scenarios that require demanding computing resources.

Precise temperature control: By precisely designing the flow rate, velocity of the coolant and the structural parameters of the hot and cold plate, the precise temperature control of the heating element can be achieved to meet the needs of some applications requiring high temperature accuracy, such as precision electronic instruments and medical equipment. It can control the temperature fluctuation within a very small range, ensure that the equipment works in a stable temperature environment, improve the accuracy and repeatability of the measurement or experiment, and ensure the stable performance of the equipment and reliable data.

Compact structure design: The integrated design of the hot and cold plate and the coolant circulation system makes the entire radiator compact and occupies a small space, which is easy to integrate into a variety of complex electronic equipment. Whether it is a laptop with limited space, a small server, or an industrial control system with high requirements for compact layout, it can be easily adapted, providing strong support for the miniaturization and integrated development of the device, while not affecting the layout and functional realization of other components inside the device, helping to improve the overall performance and portability of the device.

High reliability and stability: The use of high-quality copper and advanced manufacturing processes to ensure that the hot and cold plate has good corrosion resistance, mechanical strength and sealing. Coolant circulation system pumps, pipes and joints and other components are also strictly screened and tested, can be long-term stable operation in harsh working environment, such as high temperature, high humidity, strong vibration and other environmental conditions, still maintain excellent heat dissipation performance, reduce the risk of equipment shutdown due to cooling system failure, improve equipment availability and maintenance. Reduce operating costs and maintenance workload.

Low noise operation: Compared with traditional air cooled radiators, liquid cooled copper hot cold plate radiators produce extremely low noise during operation. Because it mainly relies on the natural convection of the coolant and the low-speed fan of the external radiator (even without the fan in some efficient cooling designs) for heat dissipation, the large noise generated by high-speed fan rotation in the air-cooled radiator is avoided, providing a quiet operating environment for noise-sensitive application scenarios (such as libraries, offices, medical environments, etc.). Improve the user experience and work efficiency, but also in line with the development trend of modern electronic devices for low noise design.

Strong scalability: the size of the hot and cold plate, the flow structure and the parameters of the coolant circulation system can be flexibly adjusted according to different heat dissipation requirements, which can easily meet the heat dissipation requirements of small power to high power electronic devices. By increasing the area of the hot and cold plate, optimizing the flow channel layout or improving the flow and heat dissipation capacity of the coolant, it can realize the effective heat dissipation of the higher power heating components, and provide a broad space for the performance upgrade and technological innovation of electronic equipment. It has strong adaptability and scalability, and can keep up with the pace of the development of electronic technology. Meet changing market needs.

FAQ

Q: What is liquid cooled copper hot and cold plate radiator?

A: Liquid cooled copper hot and cold plate radiator is a heat dissipation device that uses liquid working medium (such as water, coolant, etc.) to take away heat through the circulation closed in the copper flow channel. It is often used for efficient thermal management, such as high-performance computers, servers and new energy vehicles.

Q: What is the working principle of liquid cooled copper hot and cold plate radiator?

A: The liquid cooled copper hot and cold plate radiator is powered by a water pump, so that the coolant circulates in the closed copper flow channel. The heat generated by the heating device is transferred to the cold plate, then carried away by the coolant, and finally released to the external environment through the condenser.

Q: Why choose copper as the material of liquid cooling plate?

A: Copper has good thermal conductivity and high mechanical strength, and can transfer heat quickly and effectively. In addition, copper has corrosion resistance and is easy to process, making it an ideal material for liquid cooling plates.

Q: What are the advantages of liquid cooled copper hot plate radiators?

A: The liquid cooled copper hot and cold plate radiator has the advantages of high heat dissipation efficiency, good temperature uniformity, low noise and high reliability. It is suitable for thermal management applications with high power density and space constraints.

Q: How to design the flow channel of liquid cooled copper hot and cold plate radiator?

A: The flow channel design needs to consider factors such as the distribution of heat sources, the flow performance of the fluid and the manufacturing process. Common runner forms include parallel runner, serpentine runner and micro channel to improve heat dissipation efficiency and reduce flow resistance.

Q: What are the production processes of liquid cooled copper hot and cold plate radiators?

A: The production process includes raw material stamping, cleaning, soldering, riveting, brazing, testing and sealing steps. Among them, brazing is the key connection process to ensure the tightness and reliability of the flow path.

Q: What scenarios are liquid cooled copper hot and cold plate radiators suitable for?

A: It is suitable for the heat dissipation of high-power electronic equipment, such as CPU, GPU, memory bar, server, base station, new energy vehicle power battery pack, aerospace equipment, industrial manufacturing equipment and medical equipment.